Pubblicato su stage4eu il: 20/11/2019 Dow, Campus Internship 2019/2020: Research & Development: Disassembly of thermal interface materials

Rue Jules Bordet, Seneffe, Belgio
Engineering, Biologia/Chimica/Farmaceutica
6 mesi 
Posti disponibili Non specificato
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Thermal Interface Materials (TIM) are materials designed to dissipate the accumulated heat produced in electronic devices towards the environment. These materials must develop a strong adhesion to ensure good performance is maintained during exposure to external factors, such as sunlight (high temperature, oxidation) or humid climates (moisture permeation, hydrolysis).
However, in expensive electronics, maintenance might be required over lifetime, or some parts may be reused or recycled. Therefore, TIM must be removable and allow the disassembly without damaging the device.
This internship project proposes an insight to the balance between both requirements, where new methods must be created to evaluate disassembly shaping the next generation of silicones.

Requisiti principali:
  • You understand safety as a top priority, and are willing to accept and collaborate in our standards.
  • You are currently studying for a Master's Degree or equivalent in Material Science or Polymer Chemistry, with an interest in electronics.
  • You have a good working and writing knowledge of English. Fluency in local language (French) is not a requirement but will be considered.
  • You have experience working in a laboratory and understand the importance of protocols and methodology. Your attention to detail and creative thinking will be critical to identify the key parameters and design new ways of testing them.
  • You have report writing skills and are willing to divulgate your findings across the organization.

This offer is not limited to graduation year students, more junior candidates will also be considered, based on talents and competencies.