- Collaborate with product engineering teams, layout and manufacturing teams in the debugging of new semiconductor packages by running mechanical and thermal simulations in Ansys and Cadence
- Understand different semiconductor package technology as well as constraints and dependencies of electrical, mechanical and thermal behavior
- Run thermal simulations to evaluate and better understand package thermal behaviors to order to drive future package improvements
- Drive improvements in simulation setups for better usability and process optimization
- Setting up and qualifying products within our TI’s manufacturing processes and flows
- Cooperating closely with multiple product development functions and worldwide packaging and AT sites teams.
ultime offerte
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