Pubblicato su stage4eu il: 05/06/2019 GE, Working Student: High-Temperature Electronics Design & Test

GE Aviation
Munich, Germania
Engineering
Posti disponibili Non specificato
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Attività:
  • Understand the requirements for the PCB build and ASIC tests 
  • Design and test board that allows the investigation of the ASIC chip’s functionality under high temperature conditions up to 200°C
  • Layout and specify requirements for PCB manufacturing
  • Demonstrate functionality and usability by running test campaigns in the lab 

 

Requisiti principali:
  • Good Skills in one PCB layout tool such as KiCAD or Eagle
  • Good understanding of board level design that allows testing and bug fixes in the lab. Inclusion of multiple communication architectures to include but not limited to RS485, SPI and I2C.
  • Excellent data analysis and data presentation skills
  • Experience with usage of lab instruments such as oscilloscopes, function generators, climate chambers etc. using LabVIEW as a control software
  • Experience in soldering/desoldering SMD components using screen print methods and manually
  • Student of Electrical and Electronic Engineering or similar
  • Self-motivated, structured work style and good communication skills